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Qualcomm’s Top Chipset Set to Drive “The Slimmest and Lightest Foldable” Device, Confirmed

Posted on 4 June 2025

Honor is making bold claims about its upcoming Magic V5 smartphone, suggesting it will be the thinnest and lightest foldable phone on the market. However, this assertion will soon face competition as Samsung is set to unveil its new foldable devices, the Galaxy Z Flip 7 and Galaxy Z Fold 7, next month.

What is confirmed is that the Magic V5 will feature Qualcomm’s latest powerful chipset, the Snapdragon 8 Elite Leading Version. A listing on the benchmark site Geekbench verifies this, making it highly likely that this specification will hold true.

The Leading Version of the Snapdragon 8 Elite offers a slight edge in performance, with two prime cores running at 4.47GHz, compared to 4.32GHz in its predecessor. This enhancement gives devices like the Magic V5, alongside others such as the Samsung Galaxy S25 series and RedMagic 10S Pro+, an impressive performance advantage.

Additionally, the Magic V5, identified by the model number MHG-AN00 in Geekbench, is anticipated to come with a substantial 6,100 mAh battery, as noted on CMIIT’s certification website. The phone is also expected to be equipped with at least 16GB of RAM and to run on Android 15.

Rumors suggest that it could feature an 8-inch folding display and a remarkable 200-megapixel periscope camera. Honor aims to achieve several “world firsts” with the Magic V5, including the largest battery ever in a foldable phone.

To outdo the Oppo Find N5’s thickness of 8.93 mm, the Magic V5 will need to maintain a slim profile while accommodating the powerful battery. Meanwhile, another competitor, the Vivo X Fold 5, is also rumored to launch soon with a 6,000 mAh battery.

The release date for the Honor Magic V5 is rumored to be within this month, though it remains unclear whether its global launch will align with its release in China.

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