Apple’s upcoming iPad Pro may be getting a significant design update, thanks to LG’s innovative chip-on-film (CoF) technology. This advancement has the potential to reduce bezels significantly, allowing Apple to design a more compact device without compromising on screen size. The information comes from a report by a Korean outlet, suggesting that Apple is currently evaluating whether to approve LX Semicon’s display driver integrated circuit, which would work in tandem with the CoF technology. The implementation of this combination may enable a more seamless integration of the display panel with the device’s edges.
The result could be a noticeable reduction in visible bezels, effectively increasing the display area while maintaining the same overall device dimensions. This enhancement is particularly exciting for users who value aesthetics and functionality. According to the report, this technology not only allows for slimmer bezels but may also enhance signal processing efficiency, possibly leading to improved battery life. Historically, Apple has relied on Samsung’s System LSI for display driver chips in its OLED iPad Pro models; transitioning to LG’s components could diversify Apple’s supply chain and potentially lower production costs through increased competition.
While the report does not specify which iPad model will incorporate these new components, there are indications that they may be intended for the iPad Pro. The next generation of iPad Pro models is anticipated to launch in the latter half of this year, powered by the M5 chip. Future rumors also suggest the possibility of a landscape-oriented Apple logo and the introduction of Apple’s 5G modems, alongside speculation of a foldable iPad by 2027. Overall, the idea of thinner bezels is appealing, as it adds a modern touch to the device.
With the potential for increased competition between Samsung and LG, it’s possible that consumers will benefit from more rapid innovations and better pricing in the near future.