Qualcomm is set to roll out its next flagship chipset, potentially named the Snapdragon 8 Elite Gen 2, later this year. If the company adheres to its typical launch schedule, we can anticipate its debut around October. Despite this timeline, early information regarding the chip has begun to surface, revealing significant enhancements.
Recent leaks from China indicate that the new chipset will utilize second-generation Oryon CPU cores, which are expected to deliver approximately 25% improved performance. Additionally, the graphics processing unit (GPU) is projected to experience enhancements, with its cache increasing from 12 MB to 16 MB. Memory capabilities are also advancing, as the chipset will reportedly support both LPDDR5X and LPDDR6 RAM.
Another notable development is that the Snapdragon 8 Elite Gen 2 might be fabricated using TSMC’s new third-generation 3nm process, known as N3P. This innovation is anticipated to provide better performance and efficiency than the current N3E process employed in the Snapdragon 8 Elite. Early benchmarks suggest a potential 30% performance leap over the prior generation.
These improvements indicate that the Snapdragon 8 Elite Gen 2 will be a major upgrade over its predecessor, which already ranks among the top chipsets available, powering popular devices like the Galaxy S25 Ultra and Xiaomi 15 Ultra. However, MediaTek is also preparing to launch its Dimensity 9400+ chip shortly, presenting serious competition to Qualcomm. As we await the official announcement of the Snapdragon 8 Elite Gen 2, it is likely to appear in flagship smartphones such as the OnePlus 14, Xiaomi 16, and Galaxy S26 Ultra, solidifying its status in the smartphone market.